TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

TSMC states it deployed 305 distinct process technologies and manufactured 12,682 products for 534 customers in 2025.

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TSMC states it pioneered the pure-play foundry business model when it was founded in 1987 and describes itself as the world's leading dedicated semiconductor foundry.

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The registrant lists its principal executive offices at No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu 300-096, Taiwan, Republic of China.

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The registrant’s name is Taiwan Semiconductor Manufacturing Company Limited.

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TSMC states it has global operations spanning Asia, Europe, and North America and is headquartered in Hsinchu, Taiwan.

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TSMC states it pioneered the pure-play foundry business model when it was founded in 1987.

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TSMC states that it pioneered the pure-play foundry business model when it was founded in 1987.

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The filing identifies the registrant as Taiwan Semiconductor Manufacturing Company Limited ("TSMC"; NYSE: TSM).

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The filing identifies Taiwan Semiconductor Manufacturing Company Limited as “the Company” or “TSMC” and as NYSE:TSM.

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The principal executive offices are located at No. 8, Li-Hsin Road 6, Hsinchu Science Park, Hsinchu 300-096, Taiwan, Republic of China.

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Taiwan Semiconductor Manufacturing Company Limited has American Depositary Shares (ADSs) identified with NYSE:TSM.

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The filing identifies the registrant as Taiwan Semiconductor Manufacturing Company Limited.

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TSMC states it pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since.

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The Board approved distribution of employees' business performance bonus and profit sharing bonus totaling approximately NT$206,145.92 million for 2025, including NT$103,072.96 million of business performance bonus and NT$103,072.96 million of profit sharing.

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The filing identifies the registrant as Taiwan Semiconductor Manufacturing Company Limited, referred to as TSMC, with NYSE ticker TSM.

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Taiwan Semiconductor Manufacturing Company Limited is identified as TSMC and as listed on NYSE under TSM.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry since then.

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Taiwan Semiconductor Manufacturing Company Limited is the registrant.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since.

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TSMC deployed 288 distinct process technologies and manufactured 11,878 products for 522 customers in 2024.

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The filing identifies Taiwan Semiconductor Manufacturing Company Limited as TSMC, listed on the NYSE under ticker TSM.

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TSMC is headquartered in Hsinchu, Taiwan.

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TSMC deployed 288 distinct process technologies.

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TSMC states that it pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since.

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TSMC is listed on the Taiwan Stock Exchange under ticker 2330 and on the New York Stock Exchange under ticker TSM.

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The filing identifies the registrant as Taiwan Semiconductor Manufacturing Company Limited (TSMC; NYSE: TSM).

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In the United States, TSMC operates a fab in Camas, Washington, and design service centers in Austin, Texas, and San Jose, California, in addition to its manufacturing site in Phoenix.

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TSMC states it pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry since then.

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TSMC reports deploying 288 distinct process technologies and manufacturing 11,878 products for 522 customers in 2024.

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TSMC states it is headquartered in Hsinchu, Taiwan.

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The filing states the principal executive offices are at No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.

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The filing identifies Taiwan Semiconductor Manufacturing Company Ltd. as the registrant.

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The Board approved distribution of employees’ business performance bonus and profit sharing bonus totaling approximately NT$140,592.56 million for 2024, including business performance bonus of NT$70,296.28 million distributed following each quarter of 2024 and profit sharing of NT$70,296.28 million to be distributed in July 2025.

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TSMC is listed on the Taiwan Stock Exchange (TWSE: 2330) and the New York Stock Exchange (NYSE: TSM).

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The filing lists the address of principal executive offices as No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.

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TSMC states it deployed 288 distinct process technologies and manufactured 11,895 products for 528 customers in 2023.

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TSMC states that it is headquartered in Hsinchu, Taiwan.

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TSMC states it pioneered the pure-play foundry business model when it was founded in 1987 and describes itself as a dedicated semiconductor foundry.

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TSMC is identified as Taiwan Semiconductor Manufacturing Company Limited (TSMC; NYSE: TSM).

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The Dresden facility is described as a milestone in establishing what will be the EU’s first-ever FinFET-capable pure-play foundry.

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The new facility is expected to generate around 2,000 direct high-tech professional jobs.

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When fully operational, ESMC is expected to have monthly production capacity of 40,000 300mm wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology.

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Taiwan Semiconductor Manufacturing Company Ltd. is the registrant named in the Form 6-K.

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Taiwan Semiconductor Manufacturing Company Ltd. is identified as the registrant name in English.

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The filing identifies the company as Taiwan Semiconductor Manufacturing Company Limited, referred to as TSMC, with NYSE ticker TSM.

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The filing identifies the registrant as Taiwan Semiconductor Manufacturing Company Ltd.

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TSMC has global operations spanning Asia, Europe, and North America.

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TSMC deployed 288 distinct process technologies and manufactured 11,895 products for 528 customers in 2023.

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The filing identifies Taiwan Semiconductor Manufacturing Company Limited (TSMC; NYSE: TSM).

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TSMC reports that in 2023 it deployed 288 distinct process technologies and manufactured 11,895 products for 528 customers.

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The filing identifies TSMC as "(TWSE: 2330, NYSE: TSM)".

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TSMC states it pioneered the pure-play foundry business model in 1987 and has been the world’s leading dedicated semiconductor foundry since.

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TSMC stated it deployed 288 distinct process technologies and manufactured 11,895 products for 528 customers in 2023.

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TSMC Arizona’s three fabs are expected to create approximately 6,000 direct high-tech, high-wage jobs.

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The second fab will produce 2nm process technology with next-generation nanosheet transistors in addition to 3nm technology, with production beginning in 2028.

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The third fab will produce chips using 2nm or more advanced processes, with production beginning by the end of the decade.

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Preventative measures for employee safety and wellbeing were initiated, some fabs were evacuated, and all personnel were safe and returned to their workplace shortly after the incident.

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The registrant’s principal executive offices are at No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.

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The filing states that TSMC pioneered the pure-play foundry business model when it was founded in 1987.

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In 2023, TSMC deployed 288 distinct process technologies and manufactured 11,895 products for 528 customers.

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The filing identifies the company as Taiwan Semiconductor Manufacturing Company Limited (TSMC; NYSE: TSM).

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TSMC reports that in 2023 it deployed 288 distinct process technologies and manufactured 11,895 products for 528 customers.

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TSMC states that it pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry since then.

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With both fabs, the Kumamoto site is expected to directly create more than 3,400 high-tech professional jobs.

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The approved amount includes a business performance bonus of NT$50,090.53 million distributed following each quarter of 2023 and profit sharing of NT$50,090.53 million to be distributed in July 2024.

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The board approved the issuance of no more than 4,185,000 common shares of restricted stock awards for the year 2024, to be submitted to the 2024 Annual Shareholders’ Meeting for approval.

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The board approved distribution of employees’ business performance bonus and profit sharing totaling approximately NT$100,181.06 million for 2023.

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The board approved the issuance of 2,960,000 shares of 2023 employee restricted stock awards.

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With both fabs, JASM’s Kumamoto site is expected to offer a total production capacity of more than 100,000 12-inch wafers per month starting from 40, 22/28, 12/16 and 6/7 nanometer process technologies for automotive, industrial, consumer and HPC-related applications.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since.

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TSMC deployed 288 distinct process technologies, and manufactured 12,698 products for 532 customers in 2022 by providing broadest range of advanced, specialty and advanced packaging technology services.

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TSMC was founded in 1987 and pioneered the pure-play foundry business model.

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TSMC reports that in 2022 it deployed 288 distinct process technologies and manufactured 12,698 products for 532 customers.

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TSMC is identified with TWSE ticker 2330 and NYSE ticker TSM.

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The filing states that TSMC deployed 288 distinct process technologies and manufactured 12,698 products for 532 customers in 2022.

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The registrant’s principal executive offices are located at No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.

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No capital appropriations were approved by the TSMC board of directors.

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Unsecured bond tranche A has an issuance period from July 2026 to July 2031, total amount of NT$14.0 billion, coupon rate of 2.03%, bullet repayment, and interest payable annually.

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Unsecured bond tranche B has an issuance period from July 2026 to July 2036, total amount of NT$4.5 billion, and coupon rate of 2.10%.

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Investments required to realize the production capacity planned by the JV are being considered on the premise that they would receive support from the Japanese government.

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The Board approved capital appropriations of approximately US$29,442.50 million for purposes mainly including installation and upgrade of advanced technology capacity; installation and upgrade of advanced packaging, mature and/or specialty technology capacity; and fab construction and installation of fab facility systems.

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TSMC plans to make cash contributions of approximately 282 billion yen.

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Starting with this dividend distribution, TSMC will provide foreign shareholders who invest under the "Regulations Governing Investment in Securities by Overseas Compatriots and Foreign Nationals" the option to receive cash dividends in U.S. dollars.

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Sony plans to contribute approximately 465 billion yen to the JV through a combination of cash contributions and the transfer of its assets through a company split.

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The ex-dividend date and record date for entitlement to participate in the cash dividend distribution for TSMC American Depositary Shares will be December 10, 2026.

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The Board approved distribution of a NT$7.0 per share cash dividend for the second quarter of 2026, with December 16, 2026 as the record date, December 10, 2026 as the ex-dividend date, the shareholders' register closed December 12 through December 16, 2026, and payment on January 7, 2027.

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The capital contributions are expected to be made in phases based on market demand and other relevant business conditions.

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For funds lent to other parties, TSMC Development had a lending limit of NT$34,897,191 thousand, an amount approved by the Board of Directors of NT$3,896,160 thousand, and an outstanding amount of NT$2,922,120 thousand.

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TSMC reported no capital appropriations approved by its board of directors.

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TSMC reported no unsecured bonds issued by TSMC and its subsidiaries.

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TSMC Development reported a lending limit of NT$34,306,041 thousand, a board-approved amount of NT$3,830,160 thousand, and an outstanding amount of NT$2,872,620 thousand; the borrower was TSMC Washington, a wholly-owned subsidiary of TSMC.

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The board approved capital appropriations of US$21,013 million for machinery equipment for advanced technology capacity and others.

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The board approved capital appropriations of US$10,271 million for real estate and capitalized leased assets.

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TSMC issued unsecured bond tranche 115-2 A with issuance period May 2026 to May 2031, total amount NT$13.7 billion, coupon rate 1.80%, bullet repayment, and interest payable annually.

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TSMC reported funds lent to other parties by TSMC Development with a limit of lending of NT$33,700,918 thousand, an amount approved by the Board of Directors of NT$3,762,600 thousand, and an outstanding amount of NT$2,821,950 thousand.

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TSMC reported a guarantee line for TSMC* with a limit of guarantee of NT$2,356,384,101 thousand, an amount approved by the Board of Directors of NT$2,609,153 thousand, and an outstanding amount of NT$2,609,153 thousand.

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The cash dividend for the fourth quarter of 2025 was adjusted to NT$6.00003573 per common share.

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The dividend will be paid on July 9, 2026.

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The board of directors on February 10, 2026 approved distribution of NT$155,595,147,126 as a cash dividend for the fourth quarter of 2025 at NT$6.0 per common share.

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There were no capital appropriations approved by the TSMC board of directors.

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There were no unsecured bonds issued by TSMC and its subsidiaries.

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The Board approved capital appropriations of approximately US$31,284.30 million mainly for installation of advanced technology capacity and fab construction and installation of fab facility systems.

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The resolution provides for a capital increase of not more than US$20 billion from Taiwan Semiconductor Manufacturing Co., Ltd., subject to approval of the competent authorities.

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The Board approved a capital injection of not more than US$20 billion to TSMC Arizona.

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The Board approved a NT$7.0 per share cash dividend for the first quarter of 2026, set September 22, 2026 as the common stock record date, and set September 16, 2026 as the ex-dividend date.

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These investments, along with new capital investment by Sony in its existing plant in Nagasaki, are being considered on the premise of phased implementation based on market demand and support from the Japanese government.

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TSMC reported funds lent to TSMC China with a lending limit of NT$126,278,086 thousand, a board-approved amount of NT$7,867,940 thousand, and an outstanding amount of NT$7,867,940 thousand.

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Sony and TSMC are discussing potential investments by the JV.

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TSMC reported funds lent to TSMC Development with a lending limit of NT$34,100,378 thousand, a board-approved amount of NT$3,798,360 thousand, and an outstanding amount of NT$2,848,770 thousand.

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TSMC reported a guarantee with a limit of NT$2,167,838,398 thousand, a board-approved amount of NT$2,633,951 thousand, and an outstanding amount of NT$2,633,951 thousand.

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The filing states no capital appropriations were approved by TSMC board of directors.

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The filing reports unsecured bonds issued by TSMC and its subsidiaries under Tranche 115-1 A with issuance period March 2026 ~ March 2031, total amount NT$12.6 billion, coupon rate 1.72%, bullet repayment, and interest payable annually, and Tranche B with issuance period March 2026 ~ March 2036, total amount NT$4.6 billion, and coupon rate 1.78%.

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The filing reports funds lent to other parties in NT$ thousands: TSMC China* with a limit of lending of 126,692,810, amount approved by the Board of Directors of 11,144,160, and outstanding amount of 11,144,160; and TSMC Development** with a limit of lending of 34,543,156, amount approved by the Board of Directors of 3,847,680, and outstanding amount of 2,885,760.

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The board approved US$18,921 million of capital appropriations for machinery equipment for advanced technology capacity.

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The board approved US$21,372 million of capital appropriations for real estate and capitalized leased assets.

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The board approved US$4,670 million of capital appropriations for machinery equipment for advanced packaging, mature and/or specialty technology capacity.

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The filing states None for unsecured bonds issued by TSMC and its subsidiaries.

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The funds-lent table reports a row labeled TSMC China* with a limit of lending of NT$124,600,090 thousand, a Board-approved amount of NT$10,960,080 thousand, and an outstanding amount of NT$10,960,080 thousand.

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The funds-lent table reports a row labeled TSMC Development** with a limit of lending of NT$33,676,992 thousand, a Board-approved amount of NT$1,875,600 thousand, and an outstanding amount of NT$1,875,600 thousand.

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The guarantees table reports a row labeled TSMC* with a limit of guarantee of NT$2,167,838,398 thousand, a Board-approved amount of NT$2,601,248 thousand, and an outstanding amount of NT$2,601,248 thousand.

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The filing states no unsecured bonds were issued by TSMC and its subsidiaries.

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The Board approved capital appropriations of approximately US$44,962.00 million for advanced technology capacity, advanced packaging and mature and/or specialty technology capacity, fab construction, and installation of fab facility systems.

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The Board approved issuance of unsecured corporate bonds in multiple offerings in the domestic market in an amount not to exceed NT$60 billion to finance capacity expansion and/or green initiatives.

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The endorsements and guarantees table includes a TSMC** line with the amounts 204,100,000 and 204,100,000 (in NT$ thousands).

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The resolution provides for a capital increase of not more than US$30 billion from Taiwan Semiconductor Manufacturing Co., Ltd., subject to approval of the competent authorities.

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The Board approved a NT$6.0 per share cash dividend for the fourth quarter of 2025, set June 17, 2026 as the common stock record date, set June 11, 2026 as the ex-dividend date, and stated the dividend will be paid on July 9, 2026.

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In the endorsements and guarantees table, TSMC is listed with a guarantee limit of NT$1,999,322,789 thousand, a Board-approved amount of NT$2,612,898 thousand, and an outstanding amount of NT$2,612,898 thousand.

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In the funds lent to other parties table, TSMC Development is listed with a limit of lending of NT$33,770,700 thousand, a Board-approved amount of NT$1,884,000 thousand, and an outstanding amount of NT$1,884,000 thousand.

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In the funds lent to other parties table, TSMC China is listed with a limit of lending of NT$120,168,410 thousand, a Board-approved amount of NT$15,360,860 thousand, and an outstanding amount of NT$15,360,860 thousand.

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The Board approved a capital injection of not more than US$30 billion to TSMC Global Ltd., a wholly-owned subsidiary of TSMC, for the purpose of reducing foreign exchange hedging costs.

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The endorsements and guarantees table includes a TSMC*** line with the amounts 470,715,378 and 343,154,728 (in NT$ thousands).

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The filing states that no capital appropriations were approved by TSMC's board of directors.

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The filing states that no unsecured bonds were issued by TSMC and its subsidiaries.

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For funds lent to other parties, TSMC Development reported a lending limit of NT$33,818,022 thousand, board-approved amount of NT$1,886,640 thousand, and outstanding amount of NT$1,886,640 thousand.

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Under endorsements and guarantees, TSMC reported a guarantee limit of NT$1,999,322,789 thousand, board-approved amount of NT$2,616,559 thousand, and outstanding amount of NT$2,616,559 thousand.

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For funds lent to other parties, TSMC China reported a lending limit of NT$119,657,723 thousand, board-approved amount of NT$15,295,580 thousand, and outstanding amount of NT$15,295,580 thousand.

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Capital appropriation for real estate and capitalized leased assets was US$3.0 billion.

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Capital appropriation for machinery equipment for R&D capital investments and sustaining capital expenditures was US$3.6 billion.

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Capital appropriation for machinery equipment for advanced packaging, mature and/or specialty technology capacity was US$1.2 billion.

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Capital appropriation for machinery equipment for advanced technology capacity was US$7.3 billion.

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Tranche 114-5 C of the unsecured bonds has an issuance period from November 2025 to November 2035, total amount of NT$6.5 billion, and coupon rate of 1.58%.

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TSMC reported unsecured bonds issued by TSMC and its subsidiaries.

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Tranche 114-5 A of the unsecured bonds has an issuance period from November 2025 to November 2030, total amount of NT$14.0 billion, coupon rate of 1.50%, bullet repayment, and interest payable annually.

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Tranche 114-5 B of the unsecured bonds has an issuance period from November 2025 to November 2032, total amount of NT$3.0 billion, and coupon rate of 1.53%.

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The report lists a TSMC* guarantee row with a limit of NT$1,999,322,789 thousand, a Board-approved amount of NT$2,609,819 thousand, and an outstanding amount of NT$2,609,819 thousand.

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The report lists a TSMC** guarantee row showing 203,859,500 and 203,859,500 (in NT$ thousands).

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TSMC Development had a lending limit of NT$33,730,907 thousand, a Board-approved amount of NT$1,881,780 thousand, and an outstanding amount of NT$1,881,780 thousand.

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TSMC China had a lending limit of NT$117,878,297 thousand, a Board-approved amount of NT$29,181,470 thousand, and an outstanding amount of NT$15,068,120 thousand.

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The report lists a TSMC*** guarantee row showing 470,262,391 and 342,852,051 (in NT$ thousands).

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The filing reports no capital appropriations approved by TSMC's board of directors.

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The Board approved capital appropriations of approximately US$14,981.60 million for fab construction and facility systems, advanced technology capacity, advanced packaging and mature/specialty technology capacity, 2026 R&D capital investments and sustaining capital expenditures, and 2026 capitalized leased assets.

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The ex-dividend date and record date for TSMC American Depositary Shares for the cash dividend distribution will be March 17, 2026.

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The Board approved a NT$6.0 per share cash dividend for the third quarter of 2025 and set March 23, 2026 as the common stock record date and March 17, 2026 as the common stock ex-dividend date.

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The shareholders' register will be closed March 19 through March 23, 2026, and the dividend will be paid on April 9, 2026.

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The filing lists a TSMC guarantee with a limit of NT$1,832,429,590 thousand, a Board-approved amount of NT$2,557,561 thousand, and an outstanding amount of NT$2,557,561 thousand.

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Under derivatives not applying hedge accounting, the filing reports TSMC forward existing contracts with outstanding notional amount of NT$278,939,243 thousand.

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The filing lists TSMC China with a lending limit of NT$111,869,939 thousand, a Board-approved amount of NT$28,528,610 thousand, and an outstanding amount of NT$14,697,860 thousand.

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The filing lists TSMC Development** with amounts of NT$33,040,494 thousand, NT$1,844,100 thousand, and NT$1,844,100 thousand.

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The filing lists unsecured bonds issued by TSMC and its subsidiaries: 114-4 A with issuance period September 2025 to September 2030, total amount NT$13.8 billion, coupon rate 1.66%, bullet repayment, and interest payable annually; and B with issuance period September 2025 to September 2035, total amount NT$4.0 billion, coupon rate 1.73%.

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In the funds lent to other parties table, the filing lists TSMC Development with amounts of 32,821,191, 1,831,860, and 1,831,860 in NT$ thousands.

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In the funds lent to other parties table, the filing lists TSMC China with amounts of 110,876,206, 28,306,250, and 14,567,300 in NT$ thousands.

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The filing lists US$10.9 billion for real estate and capitalized leased assets.

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The filing lists US$7.8 billion for machinery equipment for advanced technology capacity.

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The filing lists US$2.0 billion for machinery equipment for advanced packaging, mature and/or specialty technology capacity.

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Under endorsements and guarantees, the filing reports TSMC with a guarantee limit of NT$1,832,429,590 thousand, a board-approved amount of NT$2,545,079 thousand, and an outstanding amount of NT$2,545,079 thousand.

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The filing reports funds lent to other parties by TSMC China with a limit of lending of NT$111,023,713 thousand, a board-approved amount of NT$28,349,930 thousand, and an outstanding amount of NT$14,586,680 thousand, and by TSMC Development with a limit of lending of NT$32,879,242 thousand, a board-approved amount of NT$1,835,100 thousand, and an outstanding amount of NT$1,835,100 thousand.

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The filing lists unsecured bond tranche B with issuance period July 2025 ~ July 2035, total amount NT$4.0 billion, and coupon rate 2.05%.

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The filing lists unsecured bond tranche 114-3 A with issuance period July 2025 ~ July 2030, total amount NT$8.3 billion, coupon rate 1.92%, and bullet repayment with interest payable annually.

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The board approved capital appropriations of approximately US$20,657.50 million for purposes including installation of advanced technology capacity, installation of advanced packaging, mature and/or specialty technology capacity, and fab construction and installation of fab facility systems.

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The board approved the issuance of unsecured corporate bonds in multiple offerings in the domestic market in an amount not to exceed NT$60 billion to finance TSMC’s capacity expansion and/or green initiatives.

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The board approved a capital injection of not more than US$10 billion to TSMC Global, a wholly-owned subsidiary of TSMC, for the purpose of reducing foreign exchange hedging costs.

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The resolution provides for a capital increase of not more than US$10 billion from Taiwan Semiconductor Manufacturing Co., Ltd., subject to approval of the competent authorities.

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The filing lists a TSMC** guarantee row containing 224,550,000 and 224,550,000.

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The filing lists a TSMC*** guarantee row containing 448,925,676 and 327,296,190.

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The filing's funds-lent table lists TSMC China with a lending limit of NT$104,946,115 thousand, board-approved amount of NT$27,626,520 thousand, and outstanding amount of NT$14,153,520 thousand.

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The filing lists TSMC Development with values of 32,187,925, 1,796,400, and 1,796,400 for lending limit, board-approved amount, and outstanding amount.

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The filing's endorsements and guarantees table lists TSMC with a guarantee limit of NT$1,825,665,032 thousand, board-approved amount of NT$2,491,406 thousand, and outstanding amount of NT$2,491,406 thousand.

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Unsecured bond issuance 114-2 Tranche B has an issuance period from June 2025 to June 2035, total amount of NT$1.6 billion, and coupon rate of 2.05%.

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Unsecured bond issuance 114-2 Tranche A has an issuance period from June 2025 to June 2030, total amount of NT$12.5 billion, coupon rate of 1.92%, bullet repayment, and interest payable annually.

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The filing lists a TSMC guarantee row as 'TSMC*** 437,140,253 318,703,845' (in NT$ thousands).

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The filing lists a TSMC guarantee row as 'TSMC** 218,655,000 218,655,000' (in NT$ thousands).

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Under funds lent to other parties, the filing lists TSMC China with a lending limit of 102,591,458, amount approved by the Board of Directors of 26,955,260, and outstanding amount of 13,835,960 (in NT$ thousands).

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Under endorsements and guarantees, the filing lists a TSMC guarantee row with limit of guarantee of 1,825,665,032, amount approved by the Board of Directors of 2,426,001, and outstanding amount of 2,426,001 (in NT$ thousands).

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The filing lists a TSMC Development lending row with amounts 31,342,911; 1,749,240; and 1,749,240 (in NT$ thousands).

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The TSMC board of directors approved capital appropriation of US$9,590 million for machinery equipment for advanced technology capacity.

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The TSMC board of directors approved capital appropriation of US$308 million for machinery equipment for advanced packaging, mature and/or specialty technology capacity.

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The TSMC board of directors approved capital appropriation of US$5,350 million for real estate and capitalized leased assets.

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The endorsements and guarantees table listed TSMC* amounts of NT$1,825,665,032 thousand, NT$2,496,149 thousand, and NT$2,496,149 thousand; TSMC** amounts of NT$224,977,500 thousand and NT$224,977,500 thousand; and TSMC*** amounts of NT$449,780,344 thousand and NT$308,071,468 thousand; footnotes state the guarantees were provided to TSMC North America, TSMC Global, and TSMC Arizona, respectively, each a wholly-owned subsidiary of TSMC.

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For funds lent to other parties, TSMC China had a lending limit of NT$105,036,873 thousand, a board-approved amount of NT$34,330,650 thousand, and an outstanding amount of NT$17,498,880 thousand; TSMC Development had a lending limit of NT$32,249,205 thousand, a board-approved amount of NT$1,799,820 thousand, and an outstanding amount of NT$899,910 thousand; the borrowers were TSMC Nanjing and TSMC Washington, each described as a wholly-owned subsidiary of TSMC.

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The filing states that the unsecured bonds issued by TSMC and its subsidiaries item is inapplicable.

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TSMC Arizona Corporation issued 3.05 million shares, out of the 7.5 million shares authorized on September 6, 2024, with par value US$1,000 per share to Taiwan Semiconductor Manufacturing Co., Ltd.

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The Board approved capital appropriations of approximately US$15,247.70 million for advanced technology capacity, advanced packaging/mature/specialty technology capacity, and fab construction and facility systems.

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For Japan Advanced Semiconductor Mfg., Inc. forward margin payment, existing contracts had an outstanding notional amount of NT$10,944,720 thousand and mark to market of outstanding contracts of NT$105,571 thousand.

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The filing reports TSMC Development with a limit of lending of NT$34,487,308 thousand, an amount approved by the Board of Directors of NT$1,927,200 thousand, and an outstanding amount of NT$963,600 thousand.

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For TSMC China forward margin payment, existing contracts had an outstanding notional amount of NT$522,690 thousand and mark to market of outstanding contracts of NT$1,680 thousand.

Open the SEC filing

The filing reports TSMC China with a limit of lending of NT$108,704,697 thousand, an amount approved by the Board of Directors of NT$36,536,500 thousand, and an outstanding amount of NT$22,082,500 thousand.

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For TSMC Nanjing forward margin payment, existing contracts had an outstanding notional amount of NT$1,663,812 thousand and mark to market of outstanding contracts of NT$4,039 thousand.

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The filing lists 'TSMC** 240,900,000 240,900,000' in the endorsements and guarantees table.

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The filing lists 'TSMC*** 481,612,983 329,874,839' in the endorsements and guarantees table.

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For TSMC forward margin payment, existing contracts had an outstanding notional amount of NT$143,528,519 thousand and mark to market of outstanding contracts of NT$3,201,952 thousand.

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The filing reports TSMC with a limit of guarantee of NT$1,715,418,067 thousand, an amount approved by the Board of Directors of NT$2,672,811 thousand, and an outstanding amount of NT$2,672,811 thousand.

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For TSMC Global future margin payment, the filing reports margin payment of (7,066), existing contracts outstanding notional amount of NT$1,063,172 thousand, and mark to market of outstanding contracts of (1,715).

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The filing states item 5 as 'The unsecured bonds issued by TSMC and its subsidiaries: Inapplicable' and includes a bond table for Tranche 114-1: A with issuance period March 2025 ~ March 2030, total amount NT$12.0 billion, coupon rate 1.90%, bullet repayment, and interest payable annually; B with issuance period March 2025 ~ March 2035, total amount NT$7.2 billion, and coupon rate 2.05%.

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The endorsements and guarantees table includes the line 'TSMC*** 489,580,416 341,017,872'.

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Under funds lent to other parties, TSMC Development had a lending limit of NT$35,652,275 thousand, a Board-approved amount of NT$1,992,300 thousand, and an outstanding amount of NT$996,150 thousand.

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The endorsements and guarantees table includes the line 'TSMC** 249,037,500 249,037,500'.

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Under endorsements and guarantees, TSMC had a guarantee limit of NT$1,715,418,067 thousand, a Board-approved amount of NT$2,763,098 thousand, and an outstanding amount of NT$2,763,098 thousand.

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Under funds lent to other parties, TSMC China had a lending limit of NT$112,696,976 thousand, a Board-approved amount of NT$37,835,750 thousand, and an outstanding amount of NT$22,893,500 thousand.

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The filing lists machinery equipment for advanced technology capacity at US$710 million.

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The filing lists real estate and capitalized leased assets at US$14,584 million.

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The filing lists machinery equipment for advanced packaging, mature and/or specialty technology capacity at US$1,847 million.

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The filing lists TSMC Development's limit of lending as NT$35,217,426 thousand, the amount approved by the Board of Directors as NT$1,968,000 thousand, and the outstanding amount as NT$984,000 thousand.

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The filing lists TSMC China's limit of lending as NT$111,070,036 thousand, the amount approved by the Board of Directors as NT$37,323,000 thousand, and the outstanding amount as NT$22,563,000 thousand.

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TSMC states its total U.S. investment is expected to reach US$165 billion, building on an ongoing $65 billion investment in Phoenix, Arizona.

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TSMC reported that capital appropriations approved by TSMC board of directors were inapplicable.

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TSMC reported that unsecured bonds issued by TSMC and its subsidiaries were inapplicable.

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To meet long-term capacity plans based on market demand forecasts and TSMC’s technology development roadmap, the Board approved capital appropriations of approximately US$17,141.40 million for purposes including installation and upgrade of advanced technology capacity; installation and upgrade of advanced packaging, mature and/or specialty technology capacity; and fab construction and installation of fab facility systems.

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The Board approved a capital injection of not more than US$10 billion to TSMC Global Ltd., a wholly-owned subsidiary of TSMC, for the purpose of reducing foreign exchange hedging costs.

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The Board approved a NT$4.50 per share cash dividend for the fourth quarter of 2024 and set June 18, 2025 as the record date for common stock shareholders and June 12, 2025 as the ex-dividend date for common shares.

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For derivatives not applying hedge accounting, TSMC reported outstanding notional of NT$168,736,005 thousand and mark-to-market of NT$507,478 thousand; TSMC China reported NT$164,625 thousand and NT$537 thousand; TSMC Nanjing reported NT$691,425 thousand and NT$2,407 thousand; Japan Advanced Semiconductor Mfg., Inc. reported NT$9,166,921 thousand and NT$41,765 thousand.

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TSMC China had a lending limit of NT$108,298,546 thousand, board-approved amount of NT$37,301,250 thousand, and outstanding amount of NT$22,575,000 thousand; TSMC Development had a lending limit of NT$35,042,552 thousand, board-approved amount of NT$1,963,500 thousand, and outstanding amount of NT$981,750 thousand; borrowers were TSMC Nanjing and TSMC Washington, each a wholly-owned subsidiary of TSMC.

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For derivatives applying hedge accounting, TSMC Global reported future margin payment of NT$(40,743) thousand, outstanding notional of NT$1,983,135 thousand, mark-to-market of NT$1,295 thousand, cumulative unrealized loss of NT$9,688 thousand, and cumulative realized profit of NT$7,600 thousand.

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TSMC reported guarantees to TSMC North America (limit NT$1,596,007,661 thousand; approved NT$2,723,155 thousand; outstanding NT$2,723,155 thousand), TSMC Global (limit NT$245,437,500 thousand; approved NT$245,437,500 thousand), TSMC Arizona (limit NT$469,413,211 thousand; approved NT$311,842,336 thousand), and TSMC Design Technology Japan (limit NT$345,125 thousand; approved NT$277,200 thousand; outstanding NT$277,200 thousand), each described as a wholly-owned subsidiary of TSMC.

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The filing discloses funds lent to other parties: TSMC China with a lending limit of NT$107,696,488 thousand, Board-approved amount of NT$41,685,000 thousand, and outstanding amount of NT$26,939,400 thousand to TSMC Nanjing (a wholly-owned subsidiary); and TSMC Development with a lending limit of NT$35,088,597 thousand, Board-approved amount of NT$1,966,080 thousand, and outstanding amount of NT$983,040 thousand to TSMC Washington (a wholly-owned subsidiary).

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The filing reports board-approved capital appropriation of US$11,215 million for real estate and capitalized leased assets.

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The filing reports board-approved capital appropriation of US$4,265 million for machinery equipment for advanced technology capacity, R&D capital investments, sustaining capital expenditures and others.

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The filing reports a row for TSMC China with lending limit of NT$107,799,629 thousand, amount approved by the Board of Directors of NT$45,195,460 thousand, and outstanding amount of NT$30,560,560 thousand.

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The filing reports for TSMC a guarantee limit of NT$1,596,007,661 thousand, amount approved by the Board of Directors of NT$2,706,263 thousand, and outstanding amount of NT$2,706,263 thousand.

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The filing reports for TSMC Development a lending limit of NT$34,825,176 thousand, amount approved by the Board of Directors of NT$1,951,320 thousand, and outstanding amount of NT$975,660 thousand.

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The filing reports for TSMC Japan Ltd. a guarantee limit of NT$353,013 thousand, amount approved by the Board of Directors of NT$283,536 thousand, and outstanding amount of NT$283,536 thousand.

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Capital appropriations approved by TSMC board of directors were inapplicable.

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Unsecured bonds issued by TSMC and its subsidiaries were inapplicable.

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The Board approved capital appropriations of approximately US$15,479.95 million for purposes including fab construction, installation of fab facility systems, installation of advanced technology capacity, 2025 R&D capital investments and sustaining capital expenditures, and 2025 capitalized leased assets.

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The Board approved issuance of unsecured corporate bonds in multiple offerings in the domestic market in an amount not to exceed NT$60 billion to finance capacity expansion and/or pollution prevention related expenditures.

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The filing reports funds lent to other parties by TSMC China with a lending limit of NT$104,837,062 thousand, an amount approved by the Board of Directors of NT$45,039,460 thousand, and an outstanding amount of NT$30,611,560 thousand.

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The filing reports funds lent to other parties by TSMC Development with a lending limit of NT$34,480,469 thousand, an amount approved by the Board of Directors of NT$1,923,720 thousand, and an outstanding amount of NT$961,860 thousand.

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The filing states that capital appropriations approved by TSMC board of directors were inapplicable.

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The filing states that unsecured bonds issued by TSMC and its subsidiaries were inapplicable.

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TSMC reported a guarantee limit of NT$1,516,561,150 thousand, a board-approved amount of NT$2,632,702 thousand, and an outstanding amount of NT$2,632,702 thousand.

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TSMC China had a lending limit of NT$105,039,670 thousand, a board-approved amount of NT$50,320,300 thousand, and an outstanding amount of NT$36,083,200 thousand.

Open the SEC filing

The capital appropriations section lists US$7,079 million for machinery equipment for advanced packaging, mature and/or specialty technology capacity.

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The capital appropriations section lists US$8,320 million for real estate and capitalized leased assets.

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The capital appropriations section lists US$14,216 million for machinery equipment for advanced technology capacity.

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TSMC reported the item for unsecured bonds issued by TSMC and its subsidiaries as inapplicable.

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The filing reported funds lent to other parties in NT$ thousands: TSMC China had a limit of lending of 104,920,900, an amount approved by the Board of Directors of 50,424,400, and an outstanding amount of 36,042,400; TSMC Development had a limit of lending of 34,370,775, an amount approved by the Board of Directors of 1,917,600, and an outstanding amount of 958,800.

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The filing reported endorsements and guarantees in NT$ thousands: TSMC* 1,516,561,150, 2,659,497, and 2,659,497; TSMC** 239,700,000 and 239,700,000; TSMC*** 384,556,143 and 256,716,128; and TSMC Japan Ltd.**** 356,414, 291,060, and 291,060.

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TSMC Global Ltd. issued 5,000 shares with par value US$1,000,000 per share to Taiwan Semiconductor Manufacturing Co., Ltd.

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The filing reports NT$0.7 billion of buildings and facilities acquisition.

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Total investments are expected to exceed 10 billion euros consisting of equity injection, debt borrowing, and support from the European Union and German government.

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The Board approved capital appropriations of approximately US$29,615.47 million for advanced technology capacity, advanced packaging, mature and/or specialty technology capacity, fab construction, and fab facility systems.

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The board approved a capital injection of not more than US$7.5 billion to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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TSMC Development is listed with a lending limit of NT$35,457,356 thousand, board-approved amount of NT$1,973,700 thousand, and outstanding amount of NT$986,850 thousand.

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TSMC has a guarantee line listed with a limit of NT$395,806,456 thousand and board-approved amount of NT$264,226,440 thousand.

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TSMC Japan Ltd. has a guarantee with a limit of NT$323,444 thousand, board-approved amount of NT$282,612 thousand, and outstanding amount of NT$282,612 thousand.

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TSMC has a guarantee with a limit of NT$1,454,292,772 thousand, board-approved amount of NT$2,737,302 thousand, and outstanding amount of NT$2,737,302 thousand.

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TSMC China is listed with a lending limit of NT$103,306,070 thousand, board-approved amount of NT$51,220,350 thousand, and outstanding amount of NT$36,417,600 thousand.

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The filing lists a capital appropriation approved by the TSMC board of directors of US$11,014 million for real estate and capitalized leased assets.

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The filing lists a capital appropriation approved by the TSMC board of directors of US$4,294 million for machinery equipment for advanced packaging, mature and/or specialty technology capacity.

Open the SEC filing

The filing lists a capital appropriation approved by the TSMC board of directors of US$2,048 million for machinery equipment for advanced technology capacity.

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The filing states that unsecured bonds issued by TSMC and its subsidiaries are inapplicable.

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Under funds lent to other parties, the filing listed TSMC China with a lending limit of NT$101,476,961 thousand, board-approved amount of NT$50,393,300 thousand, and outstanding amount of NT$35,772,800 thousand.

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The filing lists unsecured bond issuance tranche 113-2 A with May 2024 ~ May 2029, NT$4.9 billion, a 1.98% coupon rate, bullet repayment, and interest payable annually; and tranche B with May 2024 ~ May 2034, NT$6.6 billion, and a 2.10% coupon rate.

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Funds lent to other parties by TSMC China had a limit of NT$101,688,012 thousand, board-approved amount of NT$50,454,200 thousand, and outstanding amount of NT$35,847,200 thousand.

Open the SEC filing

TSMC provided a guarantee with a limit of NT$1,454,292,772 thousand, board-approved amount of NT$2,701,104 thousand, and outstanding amount of NT$2,701,104 thousand.

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TSMC Japan Ltd. provided a guarantee with a limit of NT$313,322 thousand, board-approved amount of NT$273,768 thousand, and outstanding amount of NT$273,768 thousand.

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The Board approved capital appropriations of approximately US$17,356.20 million for installation and upgrade of advanced technology capacity; installation and upgrade of advanced packaging, mature and/or specialty technology capacity; and fab construction and installation of fab facility systems.

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The Board approved a capital injection of not more than US$5 billion to TSMC Global Ltd., a wholly-owned subsidiary of TSMC, for the purpose of reducing foreign exchange hedging costs.

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TSMC Global Ltd. issued 3,000 shares with par value US$1,000,000 per share to Taiwan Semiconductor Manufacturing Co., Ltd.

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The filing states capital appropriations approved by TSMC board of directors are inapplicable.

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The filing states unsecured bonds issued by TSMC and its subsidiaries are inapplicable.

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The resolution approved the distribution of a NT$4.00 per share cash dividend for the first quarter of 2024.

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The filing reports a TSMC China lending limit of NT$99,167,681 thousand, a board-approved amount of NT$54,141,090 thousand, and an outstanding amount of NT$39,510,240 thousand.

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The filing lists unsecured bond tranche 113-1 A with issuance period March 2024 to March 2029, total amount NT$12.0 billion, coupon rate 1.64%, bullet repayment, and interest payable annually.

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The filing lists unsecured bond tranche B with issuance period March 2024 to March 2034, total amount NT$10.8 billion, and coupon rate 1.76%.

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TSMC Japan Ltd. reported a guarantee limit of NT$314,853 thousand, a Board-approved amount of NT$279,444 thousand, and an outstanding amount of NT$279,444 thousand.

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TSMC reported a guarantee limit of NT$1,383,565,451 thousand, a Board-approved amount of NT$2,662,576 thousand, and an outstanding amount of NT$2,662,576 thousand.

Open the SEC filing

TSMC China reported a lending limit of NT$97,842,441 thousand, a Board-approved amount of NT$53,380,890 thousand, and an outstanding amount of NT$38,982,240 thousand.

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TSMC stated the third fab brings total capital expenditure for the Phoenix, Arizona site to more than US$65 billion.

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The PMT also proposes to provide TSMC with up to US$5 billion in loans in addition to the proposed US$6.6 billion in direct funding.

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TSMC plans to apply for U.S. Treasury Department Investment Tax Credits of up to 25% of the qualified capital expenditure at TSMC Arizona.

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The filing lists capital appropriations approved by TSMC board of directors of US$6.3 billion for machinery equipment for advanced technology capacity, US$0.9 billion for machinery equipment for advanced packaging, mature and/or specialty technology capacity, and US$2.2 billion for real estate and capitalized leased assets.

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In the funds lent to other parties table in NT$ thousands, the TSMC China row lists a limit of lending of 97,265,962, an amount approved by the Board of Directors of 53,006,760, and an outstanding amount of 38,752,560.

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The filing states that capital appropriations approved by the TSMC board of directors are inapplicable.

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The borrower for TSMC's lending is TSMC Arizona, a wholly-owned subsidiary of TSMC.

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A guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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Under 'TSMC*', the limit of guarantee was NT$1,383,565,451 thousand, the amount approved by the Board of Directors was NT$2,602,912 thousand, and the outstanding amount was NT$2,602,912 thousand.

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The borrower for TSMC China's lending is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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A guarantee was provided to TSMC Design Technology Japan, a wholly-owned subsidiary of TSMC.

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A guarantee was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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A guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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TSMC Japan Ltd. reported a limit of guarantee of NT$314,555 thousand, an amount approved by the Board of Directors of NT$279,180 thousand, and an outstanding amount of NT$279,180 thousand.

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TSMC China reported a limit of lending of NT$96,230,066 thousand, an amount approved by the Board of Directors of NT$52,415,840 thousand, and an outstanding amount of NT$38,339,840 thousand.

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The board approved capital appropriations of approximately US$9,421.48 million for purposes including installation of advanced technology capacity; installation of advanced packaging, mature and/or specialty technology capacity; fab construction and installation of fab facility systems, including construction of the Zero Waste Manufacturing Center at the Southern Taiwan Science Park; and capitalized leased assets.

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Together with JASM’s first fab, the overall investment in JASM will exceed US$20 billion with strong support from the Japanese government.

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The board approved a capital injection of not more than US$5 billion to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The board approved a capital injection of not more than US$3 billion to TSMC Global Ltd., a wholly-owned subsidiary of TSMC, for the purpose of reducing foreign exchange hedging costs.

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The board approved a capital injection of not more than US$5.262 billion to Japan Advanced Semiconductor Manufacturing, Inc. (JASM).

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The table reports TSMC's limit of lending as NT$334,834,966 thousand, Board-approved amount as NT$92,241,000 thousand, and outstanding amount as '-' for funds lent to other parties.

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The table reports TSMC China's limit of lending as NT$93,104,809 thousand, Board-approved amount as NT$51,987,670 thousand, and outstanding amount as NT$38,151,520 thousand.

Open the SEC filing

The filing lists capital appropriations approved by TSMC board of directors: USD84 million for machinery equipment for advanced technology capacity; USD1,600 million for machinery equipment for advanced packaging, mature and specialty technology capacity; USD2,194 million for machinery equipment for R&D capital investments and sustaining capital expenditures; and USD464 million for real estate and capitalized leased assets.

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In the financial derivative transactions section stated in NT$ thousands, the filing reports for TSMC forward contracts not applying hedge accounting: existing contracts outstanding notional amount 52,569,922, mark to market of outstanding contracts 553,172, cumulative unrealized profit/loss 18,385, expired contracts cumulative notional amount 608,889,033, and cumulative realized profit/loss 6,103,414.

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The filing reports for TSMC Nanjing forward contracts: existing contracts outstanding notional amount 4,611,022, mark to market of outstanding contracts 75,087, cumulative unrealized profit/loss 172,045, expired contracts cumulative notional amount 51,085,359, and cumulative realized profit/loss 129,913.

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The filing reports for TSMC China forward contracts: existing contracts outstanding notional amount 2,064,509, mark to market of outstanding contracts 33,822, cumulative unrealized profit/loss (348,002), expired contracts cumulative notional amount 135,289,680, and cumulative realized profit/loss (553,717).

Open the SEC filing

In the funds lent to other parties table stated in NT$ thousands, TSMC reported a lending limit of 334,834,966, a Board-approved amount of 93,804,000, and an outstanding amount shown as '-'.

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The funds lent to other parties table lists a TSMC China row with amounts 94,165,698, 52,656,840, and 38,586,240.

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Unsecured bond issuance 112-5 tranche B has an issuance period from October 2023 to October 2033, a total amount shown in the table as NT$5.5 (in billions), and a coupon rate of 1.76%.

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Unsecured bond issuance 112-5 tranche A has an issuance period from October 2023 to October 2028, a total amount shown in the table as NT$4.3 (in billions), a coupon rate of 1.62%, bullet repayment, and interest payable annually.

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The Board approved capital appropriations of approximately US$4,341.95 million for purposes including installation of advanced technology capacity; installation of advanced packaging, mature and specialty technology capacity; 2024 R&D capital investments and sustaining capital expenditures; and 2024 capitalized leased assets.

Open the SEC filing

The filing reports a TSMC China row with amounts 92,851,013, 53,601,750, and 39,006,000.

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Under funds lent to other parties, the filing reports a TSMC limit of lending of NT$318,875,046 thousand, a board-approved amount of NT$97,305,000 thousand, and an outstanding amount shown as '-'.

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A new Treasurer will be announced following the appointment by the Board of Directors of TSMC Arizona Corporation.

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Effective July 1, 2026 (July 2, 2026, Taipei Time), Gina Proctor’s position has been adjusted, and she will no longer serve as the Treasurer of TSMC Arizona Corporation.

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Wendell Huang signed the filing as Senior Vice President and Chief Financial Officer.

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The borrower of the TSMC Development lending is TSMC Washington, a wholly-owned subsidiary of TSMC.

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TSMC ceased to have representation on VIS' board of directors in June 2024.

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Wendell Huang, Senior Vice President and Chief Financial Officer, signed the report.

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Wendell Huang, Senior Vice President and Chief Financial Officer, signed the report on behalf of TSMC and is identified as TSMC spokesperson.

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Senior Director, Operations / Intelligent Manufacturing Center Mr. Span Lu was promoted to Vice President.

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Senior Director, Quality & Reliability Mr. Y.H. Wu was promoted to Vice President.

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Vice President, Corporate Planning Mr. Jonathan Lee was promoted to Senior Vice President.

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Senior Director, Research and Development / Nano Patterning Technology Dr. Y.C. Ku was promoted to Vice President.

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Wendell Huang is Senior Vice President & Chief Financial Officer.

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Wendell Huang is Senior Vice President and Chief Financial Officer and signed the report on behalf of the registrant.

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Wendell Huang signed the report as Senior Vice President and Chief Financial Officer.

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The Board approved personnel promotions, including Dr. Y.L. Wang, Dr. T.S. Chang, Dr. Michael Wu, and Dr. Geoffrey Yeap to Senior Vice President, and Mr. Y.K. Hwang, Mr. B.Z. Tien, Mr. S.S. Lin, and Dr. Lipen Yuan to Vice President.

Open the SEC filing

David Keller has completed his tenure as a director of TSMC North America.

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Sylvia Fang and Sajiv Dalal were elected as directors of TSMC North America, effective on January 23, 2026.

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Wendell Huang is Senior Vice President & Chief Financial Officer and signed the report.

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Gina Proctor, Senior Director of TSMC Arizona Corporation, is appointed as the Treasurer of TSMC Arizona Corporation effective January 6, 2026.

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The directors of TSMC Arizona Corporation remain unchanged.

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Ray Chuang, Rose Castanares, Shu-Hua (Sylvia) Fang and Jen-Chau (Wendell) Huang were elected as directors of TSMC Arizona Corporation.

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The filing states Wei-Jen Lo joined TSMC as Vice President in July 2004 and was promoted to Senior Vice President in February 2014.

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The filing states Lo officially retired from TSMC on July 27, 2025.

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The filing states that in March 2024 Lo was transferred to TSMC's Corporate Strategy Development and has not been responsible for supervising or managing R&D affairs since.

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The filing notes that shareholdings include shares held by related parties.

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The filing states that the borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the borrower is TSMC Washington, a wholly-owned subsidiary of TSMC.

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Sajiv Dalal was elected as CEO of TSMC North America, effective January 1, 2026.

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Wendell Huang is identified as Senior Vice President & Chief Financial Officer and signed the filing on behalf of Taiwan Semiconductor Manufacturing Company Limited.

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Y.L. Wang will step down as a Director of TSMC Arizona Corporation, effective October 1, 2025.

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Ray Chuang was elected as a Director of TSMC Arizona Corporation, effective on the same date.

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Ray Chuang was elected as CEO of TSMC Arizona Corporation, effective October 1, 2025.

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Mr. Chun-Hsien Yeh is currently the Minister of the National Development Council.

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Effective September 1, 2025, the National Development Fund, Executive Yuan of Taiwan, R.O.C. appointed Mr. Chun-Hsien Yeh as its replacement representative for Mr. Chin-Ching Liu to serve as a member of the TSMC Board of Directors.

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Alex Huang, Director of Finance Division of TSMC, is appointed as Treasurer of TSMC Global Ltd. effective August 2, 2025.

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The shareholding table note states that shareholdings include shares held by related parties.

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The filing states that the guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The filing states that the borrower under the TSMC Development lending disclosure is TSMC Washington, a wholly-owned subsidiary of TSMC.

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The filing states that the borrower under the TSMC China lending disclosure is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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The filing states that the guarantee was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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Rose Castanares was elected as a Director to fill the vacancy on the Board of Directors of TSMC Arizona Corporation, effective on the same date.

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Rick Cassidy stepped down as a Director and Chairman of TSMC Arizona Corporation, effective July 1, 2025.

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Horace Chen is Director of Accounting Division of TSMC.

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Horace Chen is appointed as the Accounting Officer of TSMC Global Ltd. effective August 16, 2025.

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The Board approved the appointment of Mr. Horace Chen as controller of TSMC, effective August 16, 2025.

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The Board approved the appointment of TSMC controller Ms. Mingli Weng as head of TSMC’s internal audit, effective August 16, 2025, due to the retirement of Mr. John Liang.

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Deloitte & Touche LLP is engaged as the accounting firm of TSMC Arizona Corporation, effective 2025.

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The report is signed by Wendell Huang, Senior Vice President & Chief Financial Officer.

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The filing identifies Dr. C.C. Wei as TSMC Chairman and CEO.

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Wendell Huang is identified as Senior Vice President and Chief Financial Officer and signed the report dated February 27, 2025.

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The Board approved the promotion of Human Resources Organization Senior Director Mr. P.H. Chen to Vice President.

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Sylvia Fang and David J. Keller were elected as directors of TSMC North America.

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The filing states that the directors of TSMC North America remain unchanged.

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The filing is signed by Wendell Huang, identified as Senior Vice President & Chief Financial Officer.

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Wendell Huang is Senior Vice President and Chief Financial Officer of Taiwan Semiconductor Manufacturing Company Ltd.

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Dr. Cliff Hou, the Senior Vice President and Deputy Co-COO of TSMC, is appointed as the Chief Information Security Officer of TSMC, effective January 1, 2025.

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The filing states that the reported shareholdings include shares held by related parties.

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Wendell Huang is identified as Senior Vice President and Chief Financial Officer in the signature block.

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Wendell Huang is Senior Vice President and Chief Financial Officer and signed the report on behalf of TSMC.

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The filing states the guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The filing states the guarantee was provided to TSMC Design Technology Japan, a wholly-owned subsidiary of TSMC.

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The filing states the guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The filing states that the borrower from TSMC China is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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The filing states that the borrower from TSMC Development is TSMC Washington, a wholly-owned subsidiary of TSMC.

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The filing states that a guarantee under the TSMC*** designation was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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Vice President Geoffrey Yeap's shareholding table shows 78,532 shares as of 8/31/2024 and 79,532 shares as of 9/30/2024, a change of 1,000.

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Sajiv Dalal is appointed as President of TSMC North America effective October 1, 2024.

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The board approved the promotion of Materials Management Organization Senior Director Ms. Vanessa Lee to Vice President.

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Wendell Huang is identified as Senior Vice President & Chief Financial Officer and signed the report.

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Dr. Mark Liu retired after the Annual Shareholders’ Meeting on June 4, 2024.

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The guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The guarantee was provided to TSMC Design Technology Japan, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states the borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

Effective from June 6, 2024, the National Development Fund, Executive Yuan of Taiwan, R.O.C. appointed Mr. Chin-Ching Liu as its replacement representative for Mr. Ming-Hsin Kung to serve as a member of the TSMC Board of Directors.

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Seven of the elected directors are identified as independent directors: Sir Peter Leahy Bonfield, Mr. Michael R. Splinter, Mr. Moshe N. Gavrielov, Dr. L. Rafael Reif, Ms. Ursula M. Burns, Ms. Lynn L. Elsenhans, and Dr. Chuan Lin.

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The shareholders meeting elected TSMC’s 16th Board of Directors, consisting of ten Directors.

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The Board unanimously elected Dr. C.C. Wei as Chairman and Chief Executive Officer (CEO).

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Wendell Huang signed the filing as Senior Vice President & Chief Financial Officer.

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The filing identifies three new candidates for Independent Directors: Ms. Ursula M. Burns, Ms. Lynn L. Elsenhans, and Dr. Chuan Lin.

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The filing identifies four current Independent Directors as candidates: Sir Peter Leahy Bonfield, Mr. Michael R. Splinter, Mr. Moshe N. Gavrielov, and Dr. L. Rafael Reif.

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Ms. Kok-Choo Chen and Mr. Yancey Hai have decided to retire from the TSMC Board.

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The filing identifies three current Directors as candidates: Dr. C.C. Wei, Dr. F.C. Tseng, and Dr. Ming-Hsin Kung.

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The filing references Chairman Dr. Mark Liu’s retirement.

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The borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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Dr. Cliff Hou was appointed as Senior Vice President and Deputy Co-Chief Operating Officer, effective on March 1, 2024.

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Mingli Weng, Director of Accounting Division of TSMC, was appointed as Accounting Officer of TSMC Global Ltd. effective March 22, 2024.

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Ten directors, including seven independent directors, are to be elected at this year’s Annual Shareholders’ Meeting.

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A footnote states that the guarantee was provided to TSMC Design Technology Japan, a wholly-owned subsidiary of TSMC.

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A footnote states that the guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

Open the SEC filing

A footnote states that the borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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A footnote states that a guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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Wendell Huang signed the Form 6-K as Senior Vice President and Chief Financial Officer.

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The Board of Directors held a special meeting and approved the appointment of Senior Vice President of R&D Dr. Y.J. Mii and Senior Vice President of Operations Mr. Y.P. Chyn as Executive Vice Presidents and Co-Chief Operating Officers of TSMC.

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The board approved promoting Vice President, Legal and General Counsel Ms. Sylvia Fang to Senior Vice President.

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The board approved promoting Vice President, Finance and Chief Financial Officer Mr. Wendell Huang to Senior Vice President.

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The filing notes that shareholdings include shares held by the related parties.

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Dr. Mark Liu joined TSMC in 1993 and assumed the role of chairman after Founder Dr. Morris Chang’s retirement since June 2018.

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TSMC announced that its Chairman Dr. Mark Liu has decided not to seek the nomination of TSMC board membership for the next term and will retire from the Company after the 2024 Annual Shareholders Meeting.

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TSMC’s Nominating, Corporate Governance and Sustainability Committee of the board recommends vice chairman Dr. C.C. Wei succeed as the company’s next Chairman, subject to the election of the incoming board in June 2024.

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Y.P. Chin is Senior Vice President of Operations and Overseas Operations Office at TSMC.

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Wendell Huang is Vice President and Chief Financial Officer of TSMC.

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The borrower for the TSMC China lending row is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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The borrower for the TSMC lending row is TSMC Arizona, a wholly-owned subsidiary of TSMC.

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Wendell Huang is Vice President and Chief Financial Officer.

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A footnote states the guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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There were no changes in the pledge of TSMC common shares by the board of directors, executive officers and shareholders owning more than 10% of total outstanding common shares.

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The reported shareholdings include shares held by related parties.

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Sony will be the sole controlling shareholder and the JV is planned to operate as a consolidated subsidiary of Sony Group Corporation.

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The guarantee marked with a triple asterisk was provided to TSMC Arizona, described as a wholly-owned subsidiary of TSMC.

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The guarantee marked with a double asterisk was provided to TSMC Global, described as a wholly-owned subsidiary of TSMC.

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The guarantee marked with a single asterisk was provided to TSMC North America, described as a wholly-owned subsidiary of TSMC.

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The borrower of the funds lent is TSMC Washington, described as a wholly-owned subsidiary of TSMC.

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TSMC reported no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares.

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Lipen Yuan, a Vice President, had a reported share count of 4,650 and 6,650, with a change shown as 2,000.

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Arthur Chuang, a Vice President, had a reported share count of 4,488,305 and 3,488,305, with a change shown as (1,000,000).

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B.Z. Tien, a Vice President, had a reported share count of 11,051 and 13,051, with a change shown as 2,000.

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TSMC reported no cancellation of TSMC common shares.

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TSMC Arizona Corporation is described as a major subsidiary of TSMC.

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The filing states there were no changes in pledges of TSMC common shares by the board of directors, executive officers, or shareholders owning more than 10% of total outstanding common shares.

Open the SEC filing

There was no cancellation of TSMC common shares.

Open the SEC filing

There were no changes in the shareholdings of TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares of TSMC.

Open the SEC filing

There were no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares of TSMC.

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TSMC currently holds approximately 27.1% of VIS shares on a fully diluted basis.

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TSMC has no plan to sell more VIS shares in the foreseeable future.

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Upon completion of the share sale, TSMC expects to reduce its shareholding in VIS to approximately 19%.

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TSMC Arizona Corporation is described as a subsidiary of TSMC.

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TSMC Arizona is described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the borrower for the TSMC Development lending line is TSMC Washington, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the guarantee was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the borrower for the TSMC China lending line is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The filing states that the guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The filing states no cancellation of TSMC common shares.

Open the SEC filing

The filing states no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares of TSMC.

Open the SEC filing

The filing lists C.C. Wei, Chairman & Chief Executive Officer, with 7,917,270 shares held as of 2/28/2026, 8,152,610 shares held as of 3/31/2026, and a change of 235,340.

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The filing states the borrowers are TSMC Nanjing and TSMC Washington, each a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states the guarantees were provided to TSMC North America, TSMC Global, and TSMC Arizona, each a wholly-owned subsidiary of TSMC.

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The filing states None for the cancellation of TSMC common shares.

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The table reports Vice President Lipen Yuan with 3,180 shares as of 1/31/2026 and 3,600 shares as of 2/28/2026, a change of 420 shares.

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The table reports Vice President Jonathan Lee with 485,797 shares as of 1/31/2026 and 486,022 shares as of 2/28/2026, a change of 225 shares.

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The filing states None for changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares.

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The table reports Vice President B.Z. Tien with 3,051 shares as of 1/31/2026 and 5,051 shares as of 2/28/2026, a change of 2,000 shares.

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The filing states that the borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the borrower is TSMC Washington, a wholly-owned subsidiary of TSMC.

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The filing states no TSMC common shares were cancelled.

Open the SEC filing

The filing states there were no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, or shareholders owning more than 10% of total outstanding common shares.

Open the SEC filing

The filing states there were no changes in the shareholdings of TSMC board of directors, executive officers, or shareholders owning more than 10% of total outstanding common shares.

Open the SEC filing

The filing states that the guarantee identified with three asterisks was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states that the borrower under the TSMC Development lending is TSMC Washington, a wholly-owned subsidiary of TSMC.

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TSMC Global Ltd. is described as a subsidiary of TSMC.

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The filing states that the borrower under the TSMC China lending is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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The filing states that the guarantee identified with two asterisks was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The filing states that the guarantee identified with a single asterisk was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The filing states that shareholdings include shares held by related parties.

Open the SEC filing

The filing states that there was no cancellation of TSMC common shares.

Open the SEC filing

The filing states that there were no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares.

Open the SEC filing

TSMC North America is identified as a major subsidiary of TSMC.

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The borrower under the TSMC Development lending line is TSMC Washington, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower under the TSMC China lending line is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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Vice President Geoffrey Yeap's reported shareholding changed from 174,694 shares to 175,694 shares, a change of 1,000 shares.

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No changes were reported in the pledge of TSMC common shares by TSMC board of directors, executive officers, or shareholders who own more than 10% of total outstanding common shares.

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Vice President Jonathan Lee's reported shareholding changed from 485,261 shares to 485,532 shares, a change of 271 shares.

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TSMC Arizona Corporation is identified as a major subsidiary of TSMC.

Open the SEC filing

The borrower for the TSMC Development lending line is TSMC Washington, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower for the TSMC China lending line is TSMC Nanjing, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The guarantee in the TSMC* row was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The guarantee in the TSMC*** row was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The guarantee in the TSMC** row was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing reports no changes in the pledge of TSMC common shares by the board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares.

Open the SEC filing

TSMC North America is described as a major subsidiary of TSMC.

Open the SEC filing

The filing states there was no cancellation of TSMC common shares.

Open the SEC filing

The filing states there were no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares.

Open the SEC filing

The filing states no TSMC common shares were canceled.

Open the SEC filing

TSMC Arizona Corporation is a major subsidiary of TSMC.

Open the SEC filing

The filing states that the borrower for TSMC China is TSMC Nanjing, a wholly-owned subsidiary of TSMC, and the borrower for TSMC Development is TSMC Washington, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing states no changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares.

Open the SEC filing

The borrower for TSMC Development is TSMC Washington, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower for TSMC China is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

TSMC Global Ltd. is described as a major subsidiary of TSMC.

Open the SEC filing

The filing reports no changes in the pledge of TSMC common shares by the board of directors, executive officers, and shareholders owning more than 10% of total outstanding common shares.

Open the SEC filing

TSMC Arizona Corporation is a subsidiary of TSMC.

Open the SEC filing

The borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower for the TSMC China lending line is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower for the TSMC Development lending line is TSMC Washington, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower under the TSMC China lending is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower under the TSMC Development lending is TSMC Washington, a wholly-owned subsidiary of TSMC.

Open the SEC filing

TSMC reported that changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC were inapplicable.

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TSMC North America is described as a subsidiary of TSMC.

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The filing's pledge table lists Vice President Jun He with 0 and 28,000 shares pledged and a change of 28,000.

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The filing's shareholding table lists Senior Vice President Wei-Jen Lo with 1,360,328 and 1,357,328 shares and a change of (3,000).

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The filing's shareholding table lists Senior Vice President Cliff Hou with 501,388 and 503,306 shares and a change of 1,918.

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The filing's shareholding table lists Vice President Jonathan Lee with 406,376 and 407,534 shares and a change of 1,158.

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The filing's shareholding table lists Senior Vice President and Chief Financial Officer Wendell Huang with 1,660,201 and 1,660,207 shares and a change of 6.

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The guarantee was provided to TSMC Design Technology Japan, a wholly-owned subsidiary of TSMC.

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Changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares were inapplicable.

Open the SEC filing

The filing states that changes in the pledge of TSMC common shares by board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares were inapplicable.

Open the SEC filing

The borrower from TSMC China is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower from TSMC Development is TSMC Washington, a wholly-owned subsidiary of TSMC.

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TSMC reported changes in pledges of common shares by board members, executive officers, and shareholders owning more than 10% as inapplicable.

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The guarantee identified by the first footnote was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The guarantee identified by the third footnote was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The guarantee identified by the second footnote was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The guarantee identified by the fourth footnote was provided to TSMC Design Technology Japan, a wholly-owned subsidiary of TSMC.

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TSMC Global Ltd. is a subsidiary of TSMC.

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The filing lists Senior Vice President Cliff Hou with 499,293 shares as of 6/30/2024, 499,822 shares as of 7/31/2024, and a change of 529.

Open the SEC filing

The filing states that changes in pledges of TSMC common shares by TSMC board members, executive officers, and shareholders owning more than 10% of total outstanding common shares were inapplicable.

Open the SEC filing

The guarantee in the TSMC Japan Ltd.**** row was provided to TSMC Design Technology Japan, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The guarantee in the TSMC*** row was provided to TSMC Arizona, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The guarantee in the TSMC* row was provided to TSMC North America, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower under the TSMC Development lending line is TSMC Washington, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The borrower under the TSMC China lending line is TSMC Nanjing, described as a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing lists Mark Liu’s shares held as 12,967,987 as of 4/30/2024 and 12,968,366 as of 5/31/2024, a change of 379.

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The Board approved a share buyback program for TSMC to buy back 3,249,000 common shares on the Taiwan Stock Exchange to offset dilution from the increase of outstanding shares due to Employee Restricted Stock Awards (RSAs) issuance.

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The filing states changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares are inapplicable.

Open the SEC filing

The shareholding change table includes rows for Chairman Mark Liu, Senior Vice President Wei-Jen Lo, Senior Vice President Cliff Hou, Senior Vice President Wendell Huang, Vice President Simon Jang, Vice President and Chief Information Officer Chris Horng-Dar Lin, and Vice President Jonathan Lee, with 3/31/2024 holdings, 4/30/2024 holdings, and changes as listed; the note states shareholdings include shares held by related parties.

Open the SEC filing

The filing states the borrower is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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The table lists Cliff Hou with 494,943 shares, 496,372 shares, and a change of 1,429.

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The table lists Wendell Huang with 1,660,154 shares, 1,660,166 shares, and a change of 12.

Open the SEC filing

The table lists Chairman Mark Liu with 12,966,722 shares, 12,967,192 shares, and a change of 470.

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The table lists Jonathan Lee with 399,321 shares, 401,044 shares, and a change of 1,723.

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The shareholding table has columns for title, name, number of shares (Note 1), shares held as of 1/31/2024 and 2/29/2024, and changes.

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The filing states that changes in the pledge of TSMC common shares by TSMC board of directors, executive officers, and shareholders who own more than 10% of total outstanding common shares are inapplicable.

Open the SEC filing

The table lists Chairman Mark Liu with 12,966,214 shares as of 12/31/2023, 12,966,722 shares as of 1/31/2024, and a change of 508.

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TSMC, SSS, DENSO and Toyota will hold equity stakes of approximately 86.5%, 6.0%, 5.5%, and 2.0% in JASM, respectively.

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Toyota will take a minority stake.

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JASM is described as TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.

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The filing states that changes in pledges of TSMC common shares by the board, executive officers, and shareholders owning more than 10% are inapplicable.

Open the SEC filing

The borrower under TSMC's lending line is TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The borrower under TSMC China's lending line is TSMC Nanjing, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The table lists shareholding changes from 10/31/2023 to 11/30/2023 for Chairman Mark Liu, Senior Vice President Y.P. Chin, Senior Vice President Cliff Hou, Vice President and Chief Financial Officer Wendell Huang, and Vice President Jonathan Lee, with changes of 550, -1,000, 1,773, 15, and 2,105 respectively.

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WaferTech became a wholly-owned subsidiary of TSMC in 2010.

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TSMC North America is identified as a subsidiary of TSMC.

Open the SEC filing

The filing identifies the borrower as TSMC Arizona, a wholly-owned subsidiary of TSMC.

Open the SEC filing

The filing identifies the borrower as TSMC Nanjing, a wholly-owned subsidiary of TSMC.

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On a consolidated basis, revenue for August 2026 was approximately NT$514.81 billion, an increase of 10.1 percent from July 2026 and an increase of 53.3 percent from August 2025.

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For derivatives applying hedge accounting, the TSMC Global future contracts entry lists future margin payment of (16,201), existing contracts outstanding notional amount of 253,144, mark-to-market of 1,467, cumulative unrealized profit/loss of 2,347, expired contracts cumulative notional amount of 9,818,823, and cumulative realized profit/loss of 22,175, in NT$ thousands.

Open the SEC filing

The TSMC China forward contracts entry lists existing contracts outstanding notional amount of 893,620, mark-to-market of 5, cumulative unrealized profit/loss of (16,567), expired contracts cumulative notional amount of 10,874,743, and cumulative realized profit/loss of 33,478, in NT$ thousands.

Open the SEC filing

The Japan Advanced Semiconductor Mfg., Inc. forward contracts entry lists a dash for existing contracts outstanding notional amount and a dash for mark-to-market, cumulative unrealized profit/loss of (4,241), expired contracts cumulative notional amount of 2,767,287, and cumulative realized profit/loss of 20,888, in NT$ thousands.

Open the SEC filing

The TSMC Nanjing forward contracts entry lists existing contracts outstanding notional amount of 2,265,965, mark-to-market of (26), cumulative unrealized profit/loss of (23,851), expired contracts cumulative notional amount of 27,028,623, and cumulative realized profit/loss of 54,191, in NT$ thousands.

Open the SEC filing

For derivatives not applying hedge accounting, the TSMC forward contracts entry lists existing contracts outstanding notional amount of 192,798,341, mark-to-market of 1,582,051, cumulative unrealized profit/loss of 4,597,248, expired contracts cumulative notional amount of 1,251,988,723, and cumulative realized profit/loss of (7,563,234), in NT$ thousands.

Open the SEC filing

TSMC's board on May 12, 2026 approved distribution of NT$181,526,590,469 as a cash dividend, NT$7.0 per common share, for the first quarter of 2026, payable October 8, 2026.

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The cash dividend for the first quarter of 2026 was adjusted to NT$7.00000137 per common share.

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The filing states that reclamation of shares from 2024 restricted stock awards between the board approval date and the record date changed the number of common shares outstanding slightly, resulting in a miniscule difference in dividend per share compared with the board-approved amount.

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TSMC and its subsidiaries reported NT$0.7 billion of disposition in equity investment.

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The filing lists as exhibit 99.1 consolidated financial statements for the six months ended June 30, 2026 and 2025 and an independent auditors' review report pursuant to International Financial Reporting Standards adopted by ROC ("Taiwan-IFRSs").

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Sony and TSMC announced the execution of a legally binding definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation as a joint venture in Koshi City, Kumamoto Prefecture, Japan.

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The Board approved the formation of a new joint venture with Sony Semiconductor Solutions Corporation for developing and manufacturing next-generation image sensors, and the subscription for shares in the joint venture of not more than 282 billion Japanese yen.

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Under the strategic partnership, Sony intends to take a leading role in the development of core image sensor technologies, as well as product planning and product design.

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The JV plans to leverage TSMC's advanced process technology and manufacturing expertise to drive development and manufacturing activities required for volume production.

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The Board of Directors approved the 2026 second quarter Business Report and Financial Statements; second quarter consolidated revenue was NT$1,270.38 billion, net income was NT$706.56 billion and diluted earnings per share were NT$27.25.

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Establishment of the JV and completion of the transaction are subject to receipt of required regulatory approvals and satisfaction of other customary closing conditions.

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The JV is expected to commence volume production in 2029.

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All other aspects of the partnership remain unchanged from the announcement titled “Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership” issued on May 8, 2026.

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Sony's contribution includes its newly constructed fab in Koshi City, Kumamoto Prefecture, Japan, in which Sony has already invested.

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TSMC announced that consolidated revenue for July 2026 was approximately NT$467.58 billion, an increase of 5.6 percent from June 2026 and an increase of 44.7 percent from July 2025.

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Revenue for January through July 2026 totaled NT$2,872.06 billion, an increase of 37.0 percent compared to the same period in 2025.

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A TSMC guarantee entry shows a limit of guarantee of NT$175,327,200 thousand and an amount approved by the Board of Directors of NT$175,327,200 thousand.

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For derivatives applying hedge accounting, TSMC Global future contracts had a margin payment of NT$(8,799) thousand, outstanding notional amount of NT$788,972 thousand, mark-to-market of outstanding contracts of NT$1,093 thousand, cumulative unrealized profit/loss of NT$1,940 thousand, expired contracts cumulative notional amount of NT$8,383,238 thousand and cumulative realized profit/loss of NT$17,164 thousand.

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Japan Advanced Semiconductor Mfg., Inc. forward contracts showed no outstanding notional amount, cumulative unrealized profit/loss of NT$(4,241) thousand, expired contracts cumulative notional amount of NT$2,767,287 thousand and cumulative realized profit/loss of NT$20,888 thousand.

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Under endorsements and guarantees, TSMC had a guarantee limit of NT$2,356,384,101 thousand, an amount approved by the Board of Directors of NT$2,701,769 thousand, and an outstanding amount of NT$2,701,769 thousand.

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A TSMC guarantee entry shows a limit of guarantee of NT$496,466,098 thousand and an amount approved by the Board of Directors of NT$355,994,349 thousand.

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For derivatives not applying hedge accounting, TSMC forward contracts had an outstanding notional amount of NT$230,720,646 thousand, mark-to-market of outstanding contracts of NT$(2,645,507) thousand, cumulative unrealized profit/loss of NT$369,689 thousand, expired contracts cumulative notional amount of NT$1,081,436,907 thousand and cumulative realized profit/loss of NT$(7,199,196) thousand.

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TSMC reported fixed-income investment acquisition of NT$11.6 billion and disposition of NT$0.4 billion.

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Exhibit 99.1 is described as a press release issued by TSMC on July 16, 2026.

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Exhibit 99.2 is described as 2026 Second Quarter Earnings Conference Presentation Material.

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TSMC provided a guarantee to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The guarantee table shows for the 'TSMC*' row a limit of NT$2,356,384,101 thousand, a board-approved amount of NT$2,656,002 thousand, and an outstanding amount of NT$2,656,002 thousand.

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TSMC provided a guarantee to TSMC North America, a wholly-owned subsidiary of TSMC.

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The guarantee table shows for the 'TSMC***' row amounts of NT$478,480,683 thousand and NT$349,217,010 thousand.

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Revenue for January through June 2026 totaled NT$2,404.48 billion, an increase of 35.6 percent compared to the same period in 2025.

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TSMC announced that consolidated revenue for June 2026 was approximately NT$442.68 billion, an increase of 6.2 percent from May 2026 and an increase of 67.9 percent from June 2025.

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TSMC Nanjing reported forward margin payment derivative contracts not applying hedge accounting with outstanding notional amount of NT$7,094,926 thousand, mark-to-market of negative NT$27,022 thousand, cumulative unrealized loss of NT$51,147 thousand, expired cumulative notional amount of NT$17,494,319 thousand, and cumulative realized profit of NT$60,559 thousand.

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TSMC reported forward margin payment derivative contracts not applying hedge accounting with outstanding notional amount of NT$201,319,113 thousand, mark-to-market of negative NT$2,393,995 thousand, cumulative unrealized profit of NT$621,201 thousand, expired cumulative notional amount of NT$910,422,961 thousand, and cumulative realized loss of NT$4,434,220 thousand.

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Japan Advanced Semiconductor Mfg., Inc. reported forward margin payment derivative contracts not applying hedge accounting with no outstanding notional amount, no mark-to-market amount, cumulative unrealized loss of NT$4,241 thousand, expired cumulative notional amount of NT$2,767,287 thousand, and cumulative realized profit of NT$20,888 thousand.

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TSMC Global reported future margin payment derivative contracts applying hedge accounting with premium income of negative NT$8,650 thousand, outstanding notional amount of NT$513,880 thousand, mark-to-market of negative NT$2,563 thousand, cumulative unrealized loss of NT$1,720 thousand, expired cumulative notional amount of NT$7,653,936 thousand, and cumulative realized profit of NT$16,726 thousand.

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TSMC China reported forward margin payment derivative contracts not applying hedge accounting with outstanding notional amount of NT$2,492,953 thousand, mark-to-market of negative NT$9,034 thousand, cumulative unrealized loss of NT$25,706 thousand, expired cumulative notional amount of NT$7,368,482 thousand, and cumulative realized profit of NT$34,051 thousand.

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The TSMC board approved cancellation of 154,454 common shares from reclaimed employee restricted stock awards, with an associated paid-in capital reduction of NT$1,544,540 and a record date of May 12, 2026.

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TSMC and its subsidiaries had NT$24.7 billion of equity investment disposition.

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TSMC and its subsidiaries had NT$24.6 billion of fixed-income investment acquisition.

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The guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The guarantee was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The filing reports changes or status of revenue, funds lent to other parties, endorsements and guarantees, and financial derivative transactions for May 2026.

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TSMC announced its net revenue for May 2026.

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On a consolidated basis, revenue for May 2026 was approximately NT$416.98 billion, an increase of 1.5 percent from April 2026 and an increase of 30.1 percent from May 2025.

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In NT$ thousands, the filing reported May net revenue of NT$416,975,163 and January through May net revenue of NT$1,961,803,721.

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Revenue for January through May 2026 totaled NT$1,961.80 billion, an increase of 30.0 percent compared to the same period in 2025.

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TSMC reported derivatives not applying hedge accounting for TSMC Forward Margin Payment with existing contracts outstanding notional amount of NT$211,234,354 thousand and mark-to-market of outstanding contracts of NT$722,513 thousand.

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TSMC Global reported derivatives applying hedge accounting for Future Margin Payment with existing contracts outstanding notional amount of NT$319,821 thousand, mark-to-market of outstanding contracts of NT$(3,138) thousand, and cumulative unrealized profit/loss of NT$(2,354) thousand.

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TSMC held its 2026 Annual Shareholders’ Meeting on June 4, 2026, and the meeting passed major resolutions.

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The shareholders acknowledged the 2025 Business Report and Financial Statements.

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The shareholders approved amendments to TSMC’s Articles of Incorporation.

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Consolidated revenue totaled NT$3,809.05 billion, net income was NT$1,717.88 billion, and diluted earnings per share were NT$66.25.

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The filing states that reclamation of shares from 2022, 2023 and 2024 restricted stock awards during the period between board approval and the record date changed the number of common shares outstanding slightly, resulting in a difference in dividend per share compared to the originally approved amount.

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TSMC reported changes in shareholdings, pledges, asset acquisitions and dispositions, capital appropriations, unsecured bonds, and common share cancellations for the month of April 2026.

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TSMC and its subsidiaries reported NT$21.7 billion of acquisition of fixed-income investment.

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TSMC and its subsidiaries reported NT$7.3 billion of disposition of equity investment.

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TSMC stated the proposed share sale will not affect its strategic relations with VIS, including outsourcing of interposer production and licensing of GaN technology to VIS.

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The proposed share sale is part of TSMC's plan to focus its resources on core business activities.

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Exhibit 99.1 is described as consolidated financial statements for the three months ended March 31, 2026 and 2025 and an independent auditors’ review report pursuant to Taiwan-IFRSs.

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TSMC plans to sell up to 152.0 million common shares of Vanguard International Semiconductor Corporation, approximately 8.1% of VIS' fully-diluted paid-in-capital, through a block trade to financial institutional investors.

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The Form 6-K is for the month of May 2026.

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TSMC Arizona Corporation adopted a Board of Directors' resolution by written consent without a meeting on May 12, 2026.

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First quarter consolidated revenue was NT$1,134.10 billion, net income was NT$572.48 billion, and diluted earnings per share was NT$22.08.

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The Board approved the 2026 first quarter Business Report and Financial Statements.

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For TSMC American Depositary Shares, the ex-dividend date and record date for the cash dividend distribution will be September 16, 2026.

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The TSMC Board of Directors held a meeting and passed resolutions.

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The shareholders’ register is to be closed September 18 through September 22, 2026 for registration transfer, and the dividend is to be paid on October 8, 2026.

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Sony Semiconductor Solutions and TSMC announced the signing of a non-binding MOU to form a strategic partnership for the development and manufacturing of next-generation image sensors.

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Under the proposed partnership, Sony and TSMC intend to establish a JV, with Sony being the majority and controlling shareholder, to set up development and production lines in Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture.

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Through the JV, the companies expect to leverage Sony’s sensor design expertise and TSMC’s process technology and manufacturing strengths as part of a collaboration aimed at enhancing image sensor performance.

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The establishment of the JV remains subject to the execution of a definitive legally binding agreement and the satisfaction of customary closing conditions.

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TSMC reported that consolidated revenue for April 2026 was approximately NT$410.73 billion, a decrease of 1.1 percent from March 2026 and an increase of 17.5 percent from April 2025.

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TSMC reported that revenue for January through April 2026 totaled NT$1,544.83 billion, an increase of 29.9 percent compared to the same period in 2025.

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The partnership seeks to explore and address emerging opportunities in physical AI applications, such as automotive and robotics.

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TSMC reported forward margin payment derivative contracts with an outstanding notional amount of NT$189,918,730 thousand, a mark-to-market amount of NT$542,087 thousand, and cumulative unrealized profit of NT$3,557,283 thousand.

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TSMC reported expired forward margin payment contracts with a cumulative notional amount of NT$569,810,573 thousand and cumulative realized loss of NT$5,918,435 thousand.

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The filing states it is to report changes in shareholdings, pledge changes, asset acquisitions and dispositions, capital appropriations, unsecured bond issuances, and cancellation of common shares for the month of March 2026.

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The filing reports NT$23.2 billion of acquisition of fixed-income investment.

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TSMC held a special meeting of the Board of Directors on April 17, 2026 to approve the revision to the agenda for TSMC’s 2026 Annual Shareholders’ Meeting.

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The proposed resolutions include accepting the 2025 Business Report and Financial Statements.

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The revised agenda includes the 2025 Audit and Risk Committee’s review report.

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The revised agenda includes a report item to report the issuance of unsecured corporate bonds.

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The proposed resolutions include revising the Articles of Incorporation, noted as newly added.

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The revised agenda includes a report item to report 2025 directors’ compensation.

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The revised agenda includes a report item to report 2025 employees’ profit sharing bonuses.

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The revised agenda includes a report item to report the business of 2025.

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The revised agenda includes a report item to report 2025 earnings distribution.

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The proposed resolutions include revising the Procedures for Acquisition or Disposal of Assets.

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TSMC announced the differences between Taiwan-IFRSs and IFRSs as issued by the IASB for its 2025 consolidated financial statements.

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Exhibit 99.2 is 2026 First Quarter Earnings Conference Presentation Material.

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The report is dated April 16, 2026.

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Exhibit 99.1 is a press release issued by TSMC on April 16, 2026.

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The major difference between TSMC’s 2025 consolidated financial statements on the basis of Taiwan-IFRSs and IFRSs as issued by the IASB was the timing of recognition of R.O.C. tax on unappropriated earnings.

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Under Taiwan-IFRSs, TSMC reported net income attributable to shareholders of the parent of NT$1,717,883 million and basic and diluted EPS of NT$$66.26 and NT$66.25 in 2025, total assets of NT$7,933,024 million, total liabilities of NT$2,472,229 million, non-controlling interests of NT$41,199 million, and equity attributable to shareholders of the parent of NT$5,419,596 million as of December 31, 2025.

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For the purpose of filing the annual report on Form 20-F with the U.S. Securities and Exchange Commission, TSMC prepared consolidated financial statements in accordance with IFRSs as issued by the IASB and reported net income attributable to shareholders of the parent of NT$1,697,604 million and basic and diluted EPS of NT65.47 in 2025; total assets of NT$7,932,843 million, total liabilities of NT$2,536,623 million, non-controlling interests of NT$41,181 million, and equity attributable to shareholders of the parent of NT$5,355,039 million as of December 31, 2025.

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TSMC announced its net revenue for March 2026.

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The revenue table reports net revenue of NT$415,191 million for March 2026, NT$317,657 million for February 2026, NT$285,957 million for March 2025, NT$1,134,103 million for January-March 2026, and NT$839,254 million for January-March 2025.

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On a consolidated basis, TSMC reported March 2026 revenue of approximately NT$415.19 billion, an increase of 30.7 percent from February 2026 and an increase of 45.2 percent from March 2025.

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The filing reports TSMC Nanjing Forward derivatives with an outstanding notional amount of 6,855,138, mark to market of outstanding contracts of (8,409), cumulative unrealized profit/loss of (32,859), expired contracts cumulative notional amount of 7,738,941, and cumulative realized profit/loss of 15,900; the equity price linked product indicator is N.

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The filing reports TSMC Global Future derivatives applying hedge accounting with a future margin payment of (10,100), outstanding notional amount of 1,086,970, mark to market of outstanding contracts of 11,578, cumulative unrealized profit/loss of 12,228, expired contracts cumulative notional amount of 4,033,651, and cumulative realized profit/loss of (178); the equity price linked product indicator is N.

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The filing reports TSMC China Forward derivatives with an outstanding notional amount of 2,574,675, mark to market of outstanding contracts of (2,946), cumulative unrealized profit/loss of (17,455), expired contracts cumulative notional amount of 3,578,667, and cumulative realized profit/loss of 17,095; the equity price linked product indicator is N.

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The filing reports Japan Advanced Semiconductor Mfg., Inc. Forward derivatives with existing contracts outstanding notional amount of -, mark to market of outstanding contracts of -, cumulative unrealized profit/loss of (4,241), expired contracts cumulative notional amount of 2,767,287, and cumulative realized profit/loss of 20,888; the equity price linked product indicator is N.

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The filing reports TSMC Forward derivatives not applying hedge accounting with an outstanding notional amount of 205,042,004, mark to market of outstanding contracts of (3,041,798), cumulative unrealized profit/loss of (26,601), expired contracts cumulative notional amount of 416,293,533, and cumulative realized profit/loss of (5,107,741); the equity price linked product indicator is N.

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TSMC reported January through March 2026 revenue totaled NT$1,134.10 billion, an increase of 35.1 percent compared to the same period in 2025.

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The filing reports NT$1.2 billion of disposition of machinery equipment.

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The filing reports NT$3.5 billion of acquisition of fixed-income investment.

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The announcement is made pursuant to the Depository Agreement for the Company’s American Depositary Shares (ADSs).

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All submissions must be submitted within this period.

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The submission period for the submission of proposed resolutions for the Annual Shareholders’ Meeting will begin on March 31, 2026 and end on April 7, 2026.

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Revenue for January through February 2026 totaled NT$718.91 billion, an increase of 29.9 percent compared to the same period in 2025.

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On a consolidated basis, revenue for February 2026 was approximately NT$317.66 billion, a decrease of 20.8 percent from January 2026 and an increase of 22.2 percent from February 2025.

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The consolidated revenue table reports February 2026 net revenue of NT$317,657 million; January 2026 net revenue of NT$401,255 million; February 2025 net revenue of NT$260,009 million; January-February 2026 net revenue of NT$718,912 million; and January-February 2025 net revenue of NT$553,297 million.

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TSMC announced its net revenue for February 2026.

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The filing states that the guarantee was provided to TSMC Arizona, a wholly-owned subsidiary of TSMC.

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The filing reports for TSMC forward contracts an outstanding notional amount of NT$290,988,753 thousand, mark-to-market of outstanding contracts of NT$1,802,728 thousand, cumulative unrealized profit/loss of NT$4,817,925 thousand, expired contracts cumulative notional amount of NT$234,582,383 thousand, and cumulative realized profit/loss of NT$(3,624,572) thousand.

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The filing states that the guarantee was provided to TSMC North America, a wholly-owned subsidiary of TSMC.

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The filing states that the guarantee was provided to TSMC Global, a wholly-owned subsidiary of TSMC.

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The filing reports for TSMC Global future contracts a future margin payment of NT$(9,847) thousand, existing contracts outstanding notional amount of NT$456,396 thousand, mark-to-market of outstanding contracts of NT$(2,305) thousand, cumulative unrealized profit/loss of NT$(1,505) thousand, expired contracts cumulative notional amount of NT$2,963,448 thousand, and cumulative realized profit/loss of NT$(2,581) thousand.

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The board of directors on November 11, 2025 approved distribution of NT$155,595,147,126 as cash dividend, NT$6.0 per common share, for the third quarter of 2025.

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The dividend will be paid on April 9, 2026.

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Due to reclamation of shares from 2022, 2023 and 2024 restricted stock awards between the board approval date and the record date of the distribution, the number of common shares outstanding changed slightly, resulting in a miniscule difference in the dividend per share compared to the original board-approved amount.

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The cash dividend for the third quarter of 2025 is adjusted to NT$6.00003573 per common share.

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Exhibit 99.2 is described as Parent Company Only Financial Statements for the Years Ended December 31, 2025 and 2024 and Independent Auditors’ Report pursuant to International Financial Reporting Standards adopted by ROC ("Taiwan-IFRSs").

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The report is dated February 26, 2026.

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Exhibit 99.1 is described as Consolidated Financial Statements for the Years Ended December 31, 2025 and 2024 and Independent Auditors’ Report pursuant to International Financial Reporting Standards adopted by ROC ("Taiwan-IFRSs").

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The filing states it reports the listed items for the month of January 2026.

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The filing reports NT$30.2 billion of acquisition of fixed-income investment.

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The filing reports NT$0.3 billion of disposition of equity investment.

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The filing reports NT$6.2 billion of acquisition of land.

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The filing states no capital appropriations were approved by TSMC's board of directors.

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TSMC Global Ltd. adopted a directors’ resolution by written consent without a meeting on February 10, 2026.

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The Board approved the 2025 Business Report and Financial Statements, with consolidated revenue of NT$3,809.05 billion, net income of NT$1,717.88 billion, and diluted earnings per share of NT$66.25.

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On a consolidated basis, TSMC's January 2026 revenue was approximately NT$401.26 billion, an increase of 19.8 percent from December 2025 and an increase of 36.8 percent from January 2025.

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The Board approved convening the 2026 AGM for 9:00 a.m. on June 4, 2026 at Sheraton Hsinchu Hotel.

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TSMC's Board of Directors held a meeting and passed resolutions.

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TSMC announced its net revenue for January 2026.

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TSMC's January 2026 net revenue table reported NT$401,255 million, compared with NT$335,003 million for December 2025 and NT$293,288 million for January 2025.

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For derivatives not applying hedge accounting, the filing reports TSMC forward margin payment existing contracts with an outstanding notional amount of NT$241,054,483 thousand and a mark-to-market value of (NT$226,612) thousand.

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For derivatives applying hedge accounting, the filing reports TSMC Global future margin payment with a future margin payment amount of (NT$6,751) thousand, existing contracts outstanding notional amount of NT$668,820 thousand, and mark-to-market of NT$1,101 thousand.

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